HDI PCB

- Feb 29, 2016-

Printed circuit board is formed by the insulation materials supplemented by conductor wiring of structural components.When made into the final product, it will install integrated circuits, transistors, diodes, passive components (such as: resistor, capacitor, connectors, etc.) and other various kinds of electronic components.Can be formed through the wires connecting, electronic signal links and due function.Therefore, printed circuit board is a platform to provide components link, to undertake contact parts base.


Because of the printed circuit board is not generally end products, so in the name of the definition, slightly chaotic, for example: personal computer motherboards, circuit board called the motherboard and cannot be directly called, even though the motherboard is the presence of circuit board but is not the same, so the evaluation industry both on but can't say the same.Again, such as: because of the load on the circuit board, IC parts and the news media called him the IC board, but actually he is not the same as printed circuit boards.


If the complication of electronic products tend to be multi-functional, integrated circuit component of contact distance is getting smaller, the speed of signal is relatively improved, followed by connection between the increase of the number and some locality to shorten the length of the wiring, these would require the application of high density line configuration and microporous technology to achieve their goals.Wiring and jumper are basically for single and double panel has its difficulties, and Circuit Board to multiple stratification, and as a result of the signal line continuously increase, more power supply layer and ground layer as the design must be means, these are prompting from layer Printed Circuit Board (Multilayer Printed Circuit Board) is more common.


To the electrical requirement of high speed signal, circuit board must be provided with an alternating current impedance control features, high frequency transmission capacity, reduce unnecessary radiation (EMI), etc.Using Stripline and Microstrip structure, multiple stratification becomes the necessary design.To reduce the quality of the signal transmission problem, will use a low dielectric coefficient, low attenuation of insulation materials, in line with the miniaturization of electronic components packaging and array, and the circuit board are also constantly increased density in response to demand.Ball Grid Array (BGA), CSP (Chip Scale Package) and DCA (Direct Chip Attachment) the emergence of groups of parts assembly way, such as more shortness of printed circuit boards to an unprecedented high level.


Who are under the diameter less than 150 um hole known in the industry of microporous (Microvia), using the geometrical structure of the microporous technology by the circuit can improve the efficiency of assembly, space utilization, etc, for the miniaturization of electronic products at the same time also has its necessity.For this type of structure of the circuit board products, the industry has too many different names to call such a circuit board.European and American companies, for example, once because the program is made by way of construction Sequence type, so this kind of product called SBU (Sequence Build Up Process), generally translated as "Sequence type layer method".As for Japanese companies, because this kind of products produced by the pore structure of holes are much smaller than in the past, therefore he called the name of this kind of product manufacture technology for the MVP (Micro Via the Process), generally translated as "microporous Process".Also called MLB someone because traditional laminated (Multilayer Board), so call this type of circuit boards' moom 'means' (Build Up Multilayer Board), generally translated as "add layer type laminated".


The American association of IPC circuit board it consider to avoid confusion, and proposed to this kind of product called HDI (High Density Intrerconnection Technology) of the common name, if direct translation becomes a high-density connection Technology.But it can't reflect the features of the circuit board, so most of the circuit board industry will be this kind of product is called the HDI board or full name in Chinese "high density interconnect technology".But because of oral flow problem, also someone says this kind of product directly for high density circuit board or HDI board.


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