Effective measures to reduce production cost of the printed circuit

- Feb 27, 2016-

As a rigid multilayer printed circuit board production cost measures, can according to the types of the printed circuit board, size, perspective of processing technology and materials, etc.


1, the size of the printed circuit board design for cost of absence made.


Apply the coin size of its original size is too large, processing is not convenient, sometimes can't even in the printed circuit board processing equipment for processing, so we need first to divide it into several pieces processing size coated copper.As for processing the size of the specific size, need according to the production of printed circuit board processing equipment situation, every piece of the size of the printed circuit board, and some process parameters to determine.These parameters in addition to outside need to the length and width of the printed circuit graphics itself, but also to frame fixed on the printed circuit board of electronic products that are consumed in the screw hole width, shape machining allowance, the technology of electroless plating, plating and corrosion of fixture clamping allowance, multilayer printed circuit board at the time of the dowel allowance, interlayer registration mark allowance, printed circuit board production manufacturer of marking allowance, printed circuit board edge width, etc., some process parameters recommended value to apply copper manufacturer or distributor.Printed circuit production and processing, can according to the data to determine the will be a big piece of the original size of the application of copper is cut into many pieces processing size is coated copper, longitudinal cutting or transverse cutting, can suit cut and so on.


2, Absence made of layers of costs in printed circuit board.


Printed circuit board with the increase of the layer number, production costs will increase sharply, so the cost of may occur because of one big difference.If you design a 6 layer printed circuit board encounter difficulties, must not speaking out of turn to give up, maybe a lot of economic benefits in adhere to the efforts of you;However, this also is very not easy to speak, because when meet this kind of thing, in most cases the designer can not hesitate to choose a 8 layers of printed circuit design.


3, CEM - 3 materials.


Produce double-sided printed circuit board used double-sided coated copper, in addition to the widely used double-sided epoxy glass cloth coated copper, still have a kind of low cost CEM - 3 material, its structure is the original double epoxy resin as base material in glass cloth coated copper thick epoxy glass cloth to make it very thin two chips, at this time due to insufficient strength, while in sandwiched between two thin slices of epoxy glass cloth of epoxy resin glass non-woven fabrics, which reduces the cost.CEM - 3 material quality of a material soft, besides can be used alone, can also be used as the core material multi-layer rigid printed circuit board.


4, conductor graphics line width and gap width ratio of the cost of absence made.


The width of the printed circuit board to import graphics to make a L said the gap width between conductors graphics use S to say, then the LIS represents the width of the conduction band and the ratio of the gap width.With the decrease of the this ratio, printed circuit board production yield will be reduced sharply, costs will rise.This kind of phenomenon in circuit density higher situation more clearly.Therefore, must not arbitrarily reduce the value of the LIS.


5, the hole of the aperture to the cost of absence made.


In the drilling of holes in printed circuit board, when the aperture is less than a certain value, a drilling bit depth will be sharply reduced.That is also a hole, hole size small hole, the bit need to exit the cooling for many times, so can reduce the production efficiency, improve the cost.So, don't reduce the hole aperture;But also should be as much as possible to reduce the number of hole.


6, with silver paste filling hole.


For communicating pores double-sided printed circuit board, need not copper plating method to implement two sides of the circuit, but with the water in the through hole filling method of silver paste, also can reduce the cost of double-sided printed circuit board.This method is commonly used in ordinary phenolic resin board double-sided coated copper.This method first double apply ordinary phenolic resin copper board surface cleaning, then in the two sides in the screen printing method to print the graphics, after corrosion form conductor graphics, remove the corrosion layer after playing through hole, and then into the hole fill silver paste.In order to make the silver paste can contact well with both sides of the conductor graphics and bulging silver paste should be well versed in hole, and in the diameter of the drum out part of the silver paste graphics is greater than the communicating pores of the aperture.In order to stop the silver ion migration, bulging in silver paste are part of the surface by screen printing with a layer of covering.Then, again in two sides welding patterns, isolation resistance of silk screen printing, stamping or drill fixed screw holes of printed circuit boards, processing shape.At last, through inspection, silver paste filling holes of double-sided printed circuit board is completed.


Generally speaking, due to base material of the silver paste filling communicating pores of the double-sided printed circuit board should not be used for the circuit with high reliability.In addition, due to the conductive silver paste, in addition to the material, there are a lot of non-conductive material, so the conductivity of silver paste is inferior to the conductivity of copper foil, also ought to draw the reader's attention.

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